The MediaTek Dimensity 8000 5G chip series are finally here comprised of the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) that bring flagship-level features to future 5G smartphones. Both are built on the TSMC 5nm production process with an octa-core CPU that is borrowed from the Dimensity 9000 platform.
“You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship-grade features and next-level energy efficiency to the premium smartphone market,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
“MediaTek’s big bet on 5G dramatically expanded its global smartphone SoC volumes in the mid-tier, and the Dimensity 9000 is opening up the flagship market,” said Avi Greengart, President of market advisory firm Techsponential. “With the Dimensity 8000, MediaTek is giving smartphone vendors more options to balance performance and pricing while still offering flagship-level gaming and AI capabilities.”
The Dimensity 8100 integrates four Arm Cortex-A78 cores running at 2.85GHz. While the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz. Both use MediaTek’s Open Resource Architecture and are equipped with Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies. It delivers frame rates at 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000. While a Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.
Moreover, both SoCs have MediaTek’s fifth-generation AI processing unit and offer power-efficient performance which optimizes AI multimedia, gaming, camera, and video experiences. Photography-wise, the Dimensity 8000 series produces the fastest and clearest HDR photos and video in its class thanks to a five gigapixel per second image signal processor (ISP).
MediaTek Dimensity 8000 5G Chip Series features:
- Support for up to 200MP cameras and 4K60 HDR10+ videography.
- MediaTek’s latest noise reduction and AI-based unblur techniques in extreme low-light environments.
- Simultaneous dual camera HDR video recording with front and rear cameras/two different lenses.
- 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier Aggregation.
- MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite.
- Support for Wi-Fi 6E and Bluetooth 5.3.
MediaTek Dimensity 1300
On the other hand, MediaTek also added the 6nm Dimensity 1300 to its 5G family with an HDR-ISP that supports up to 200MP and integrates MediaTek’s HyperEngine 5.0. It also comes with new AI enhancements, improved night shot photography, as well as HDR capabilities.
It has an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores, and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 GPU and MediaTek APU 3.0.
Smartphones powered by the Dimensity 8100, Dimensity 8000, and Dimensity 1300 will be available in the market in the first quarter of 2022.