MediaTek officially unveils the Dimensity 1050 SoC, its first mmWave 5G chipset. The SoC will have mmWave and sub-6Ghz 5G built on the TSMC’s 6nm production process sporting an octa-core CPU. It promises to deliver ultra-fast connectivity speeds, even in the most densely populated areas.
“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands,” said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. “With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines.”
The Dimensity 1050 will support 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum. Compared to LTE+mmmWave aggregation, the SoC is capable to deliver 53% faster speeds and greater reach to smartphones. It also integrates two ARM Cortex-A78 CPUs with speeds of up to 2.5Ghz and ARM Mali-G610 GPU.
On top of 5G, the Dimensity 1050 also boasts Wi-Fi optimizations through the new Wi-Fi tri-band 2.4Ghz, 5Ghz, and 6Ghz for lower latency alongside MediaTek’s HyperEngine 5.0 gaming technology, UFS 3.1 storage, and LPDDR5 memory.
Other features of the MediaTek Dimensity 1050:
- Support for True Dual 5G SIM (5G SA + 5G SA) and Dual VoNR.
- Support for 144Hz Full HD+ displays through MiraVision 760
- Dual HDR video capture engine
- Noise reduction for low-light photos and improved AI camera actions through MediaTek’s APU 550
- Wi-Fi 6E support and 2×2 MIMO antenna
MediaTek also announced two additional chipsets to expand its 5G and gaming chipset families: Dimensity 930 5G and Helio G99. The Dimensity 930 5G has 2CC-CA and mixed duplex FDD+TDD for higher download and data transfer speeds and greater reach. It is equipped with MiraVision HDR video playback and supports 120Hz Full HD+ displays and HDR10+ video. Additionally, it has HyperEngine 3.0 Lite gaming enhancements for lower latency and maximized battery life. Meanwhile, the Helio G99 is equipped with 4G/LTE with better throughput rates and power efficiency compared with Helio G96.
Smartphones powered by the Dimensity 930 will be available on the market during the second quarter of 2022; additionally, smartphones using the Dimensity 1050 and the Helio G99 will be on the market in the third quarter of 2022.