MediaTek unveils Dimensity 9000, Filogic 130, Filogic 130A, Filogic 330P chipsets

Powering devices soon

MediaTek announced the Dimensity 9000, Filogic 130, Filogic 130A, and Filogic 330P chipsets on its annual MediaTek Executive Summit 2021. The Dimensity 9000 is hailed as the world’s first TSMC 4nm-class smartphone chip. On the other hand, the Filogic 130 chipsets are designed to maximize power efficiency in the smallest and lowest-power form factors. Meanwhile, the Filogic 330P will power next-gen AMD Ryzen-series laptops and desktop PCs with WiFi 6E modules.

MediaTek Dimensity 9000

The MediaTek Dimensity 9000 embraces the most advanced and power-efficient chip-making process to date – the TSMCS N4 (4nm-class) production. It has Cortex-X2 over 3Ghz with Ultra-Core, Super-Cores, Efficiency Cores, and LPDDR5x support.

Its imaging capabilities are supported by an 18-bit HDR-ISP design that can capture HDR videos in three cameras simultaneously with support for 320MP cameras. In addition, an AI processing unit (APU) is built-in for boosting the performance in games, cameras, and video.

On the graphics side of things, the Dimensity 9000 comes with Mali-G710 GPU with a new raytracing SDK using Vulkan and supports a 180Hz FullHD+ display. To catch up with the 5G game and faster connectivity, the SoC is integrated with 3CC Carrier Aggregation, UL Tx Switching, MediaTek 5G Power Saving Technology, Bluetooth 5.3 Bluetooth LE, Beidou 111-B1C GNSS, and WiFi 6E 2×2.

MediaTek Filogic 130 and Filogic 130A

This integrates a microprocessor (MCU), AI engine, WiFi 6, Bluetooth 5.2, and a power management unit (PMU) into a single chip. In addition, the Filogic 130A integrates an audio digital signal processor that can be used by device makers to add voice assistants and other services. Moreover, the Filogic chipsets support 1T1R Wi-Fi 6 connectivity, dual-band 2.4GHz, 5GHz, target wake time (TWT), MU-MIMO, MU-OFDMA, quality of service (QoS), WPA3 Wi-Fi security, and support advanced Wi-Fi and Bluetooth coexistence.

Both integrate an Arm Cortex-M33 microcontroller which is supported by the RAM and flash storage, with an integrated front-end module (iFEM) that supports low noise amplifier (LNA) and power amplifier (PA) functionality. In addition, the Filogic 130A has an integrated HiFi4 DSP for far-field voice processing, always-on microphone capability with voice activity detection, and trigger word support.

The Filogic 130 and 130A achieved Energy Star and Green Appliance ratings and certifications and also support secure boot and hardware crypto engines, SPI, I2C, I2S, IR input, UART, AUXADC, PWM, and GPIO interfaces.

MediaTek Filogic 330P

MediaTek and AMD collaborated to create the Filogic 330P, the WiFi 6E module for the AMD RZ600 series of CPUs which comes with developed and certified PCIe and USB interfaces for modern sleep states and power management.

The Filogic 330P supports 2×2 Wi-Fi 6 (2.4/5GHz), 6E (6GHz band up to 7.125GHz), Bluetooth 5.2 (BT/BLE), 2.4Gbps connectivity throughput, and 6GHz spectrum at 160MHz channel bandwidth. It also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology.

AMD RZ600 Series Wi-Fi 6E Modules Specifications:


Wi-Fi Module

Wi-Fi Specs

M.2 Slots
   
AMD RZ616 Wi-Fi 6E module   
   
Wi-Fi 6E 2×2
   
160MHz Wi-Fi Channels
   
PHY rate up to 2.4Gbps   
   
M.2 2230 and 1216    
   
AMD RZ608 Wi-Fi 6E module   
   
Wi-Fi 6E 2×2
   
80MHz Wi-Fi Channels
   
PHY rate up to 1.2Gbps   
   
M.2 2230    

Watch out as the MediaTek Dimensity 9000, Filogic 130, Filogic 130A, and Filogic 330P will power smartphones, personal computing devices, and IoT devices soon.

Nathaniel Trillana
Nathaniel is a part-time contributor and writes for WalasTech in his free time from work. He is a fan of tech, a diehard morning radio program listener, a podcast host, and a heavy social media user.