MediaTek has introduced three new chipsets to expand the Dimensity family: the Dimensity 7400, 7400X, and 6400. These new processors bring improved AI, gaming, and connectivity features to a broader range of smartphones.
Why it matters: The Dimensity 7400 and 7400X bring AI-powered gaming and camera capabilities, while the Dimensity 6400 offers efficient 5G connectivity and power-saving features. These chipsets aim to improve mobile experiences at more affordable price points.
The Dimensity 7400 and 7400X use an octa-core CPU with four Cortex-A78 cores running up to 2.6GHz and four Cortex-A55 cores at 2.0GHz, along with a Mali-G615 MC2 GPU. Built on TSMC’s 4nm process, these chips promise 14% to 36% lower power consumption during gaming compared to competitors. They also include MediaTek Advanced Gaming Technology (MAGT) 3.0 for AI-driven game optimizations, reduced input lag, and improved power efficiency.
The Dimensity 7400 and 7400X also feature MediaTek’s NPU 6.0, which offers 15% better AI performance than the previous generation. The Imagiq 950 ISP supports AI camera features, Ultra HDR, and enhanced low-light photography. Additionally, the 7400X variant is designed for dual-display flip phones, offering more flexibility for smartphone makers.
For connectivity, these chips come with a 5G R16 modem with 3CC carrier aggregation and MediaTek UltraSave 3.0+ technology, reducing power consumption by 20%. They also support tri-band Wi-Fi 6E for high-speed wireless connectivity.
The Dimensity 6400, designed for affordable 5G smartphones, includes an octa-core CPU with two Cortex-A76 cores up to 2.5GHz and six Cortex-A55 cores at 2.0GHz, with a Mali-G57 MC2 GPU. Built on TSMC’s 6nm process, it is 19% more power-efficient during gaming compared to competing chips.
Other features of the Dimensity 6400 include MediaTek Bluetooth Wi-Fi HyperCoex technology, which reduces gaming latency by up to 90%, Release 16 Sub-6 5G modem with 2CC-CA for improved connectivity, and support for 108MP camera sensors with multi-frame noise reduction.
The first smartphones with the Dimensity 7400 and 7400X will launch in Q1 2025, while the Dimensity 6400 is already available.
Specifications
Dimensity 7400 and 7400X
- Processor: 4x Cortex-A78 (up to 2.6GHz), 4x Cortex-A55 (up to 2.0GHz)
- GPU: Mali-G615 MC2
- AI Engine: MediaTek NPU 6.0
- Process: 4nm TSMC
- Connectivity: 5G R16 modem, 3CC-CA, Wi-Fi 6E, Bluetooth
- Gaming: MAGT 3.0, AI optimizations, lower power consumption
- Camera: Imagiq 950 ISP, AI enhancements, Ultra HDR support
- Special Features: 7400X supports dual-display flip phones
Dimensity 6400
- Processor: 2x Cortex-A76 (up to 2.5GHz), 6x Cortex-A55 (up to 2.0GHz)
- GPU: Mali-G57 MC2
- AI Engine: MediaTek NPU
- Process: 6nm TSMC
- Connectivity: 5G R16 modem, 2CC-CA, Bluetooth Wi-Fi HyperCoex
- Gaming: Reduced latency, power efficiency improvements
- Camera: 108MP support, multi-frame noise reduction
How do you think these new chipsets will impact mid-range and budget smartphones in 2025?
