MediaTek Unveils Dimensity 7300 and 7300X 4nm Chips for Mobile Devices

mediatek dimensity 7300 ph

MediaTek has introduced the Dimensity 7300 and Dimensity 7300X, advanced 4nm chips designed for mobile technology. These chipsets aim to offer efficient performance suitable for modern mobile applications. The Dimensity 7300 series facilitates multitasking, photography, gaming, and AI computing. Additionally, the Dimensity 7300X supports dual displays, catering specifically to flip-style foldable devices.

mediatek dimensity 7300 ph

Both chipsets feature an octa-core CPU with 4x Arm Cortex-A78 cores operating at up to 2.5GHz, paired with 4x Arm Cortex-A55 cores. The 4nm manufacturing process reduces power consumption by up to 25% in the A78 cores compared to its predecessor, the Dimensity 7050. Supported by the Arm Mali-G615 GPU and MediaTek HyperEngine optimizations, these chipsets enhance gaming performance with a claimed 20% increase in FPS and energy efficiency.

Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business, highlighted the significance of the Dimensity 7300 chips in integrating AI enhancements and connectivity features for seamless streaming and gaming experiences. The Dimensity 7300X, in particular, supports innovative form factors with its dual display capabilities, aimed at OEMs developing next-generation mobile devices.

Photography capabilities are upgraded with the MediaTek Imagiq 950, featuring a 12-bit HDR-ISP and support for up to 200MP main cameras. Enhanced hardware engines improve noise reduction, face detection, and video HDR, enabling users to capture high-quality images and videos in various lighting conditions. Moreover, photo processing speeds are notably faster than previous models, and the chipset supports recording 4K HDR video with wider dynamic range compared to competitors.

The MediaTek APU 655 enhances AI task efficiency, delivering double the performance of its predecessor. New data types optimize memory bandwidth usage, reducing requirements for larger AI models. The Dimensity 7300 SoCs also integrate MiraVision 955, supporting WFHD+ displays with 10-bit true color and global HDR standards, enhancing media playback quality.

Key features of the Dimensity 7300 and Dimensity 7300X include MediaTek 5G UltraSave 3.0+ technology for improved power efficiency in 5G connectivity scenarios, up to 3.27Gb/s 5G downlink speed via 3CC carrier aggregation, tri-band Wi-Fi 6E support, and dual 5G SIM capability with dual VoNR. These features collectively enhance connectivity, speed, and user experience across various mobile applications.

For more information on MediaTek’s Dimensity series, visit MediaTek Dimensity Portfolio.

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