MediaTek officially launches the Dimensity 9000 5G smartphone chip for flagship smartphones. It is the world’s first smartphone chip built on the ultra-efficient TMSC N4 (4nm-class) production process that offers incredible computing performance, gaming, imaging, multimedia, and connectivity innovations. MediaTek also announced the device maker adoption and endorsements from some of the world’s biggest smartphone brands, including OPPO, vivo, Xiaomi, and Honor.
“The Dimensity 9000 is a milestone for MediaTek, highlighting our rise to incredible with a true flagship 5G smartphone chip. This chip signals MediaTek and our Dimensity family has entered a new phase of innovation,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “The Dimensity 9000 is the most powerful and energy-efficient chip to date, delivering a number of industry firsts and a full suite of features for the most discerning tech enthusiasts.”
The chipset sports the new Armv9 CPU architecture with an octa-core CPU configuration (one ultra Cortex-X2 core at up to 3.05GHz, three performance A710 cores at up to 2.85GHz, and four efficiency Cortex-A510 cores). An LPDDR5X RAM is also integrated supporting up to 7500Mbps, an 8MB L3 cache, and a 6MB system cache. In addition, it has MediaTek’s fifth-generation Application Processor Unit (APU 5.0), which offers 4X power efficiency gains compared to the previous generation APU.
Moreover, the Dimensity 9000 features the world’s first Arm Mali-G710 MC10 GPU and HyperEngine 5.0. The HyperEngine 5.0 uses AI acceleration and integrates AI-VRS, the first AI-enhanced variable-rate shading technology for smartphones, along with the industry’s first raytracing software development kit (SDK) using Vulkan for Android.
MediaTek Dimensity 9000 key features:
- MediaTek Imagiq 790: Its 18-bit HDR-ISP that supports 320MP and simultaneous triple camera 18-bit HDR video recording. Its 9Gpixel/s ISP also supports 4K HDR Video + AI noise reduction.
- 3GPP Release-16 5G Modem: The integrated 5G modem supports sub-6GHz with speeds up to 7Gbps downlink using 3CC Carrier Aggregation (300MHz). It features R16 UL enhancement, and Dual SIM Dual Active support for 4G and 5G. It also integrates the new MediaTek 5G UltraSave 2.0 power-saving enhancement suite.
- MediaTek MiraVision 790: The chipset can support 144Hz WQHD+ displays or 180Hz Full HD+ displays, with the help of MediaTek’s Intelligent Display Sync 2.0 technology. Furthermore, MediaTek’s latest Wi-Fi Display technology can support up to 4K60 HDR10+ video.
- Wi-Fi 6E, GNSS with Beidou III-B1C and Bluetooth 5.3: The flagship chipset now supports the latest Wi-Fi, Bluetooth and GNSS connectivity.
- Dimensity 5G Open Resource Architecture: This allowa smartphone device makers to create customized flagship 5G smartphones.
Adoptation by Smartphone Device Makers
“OPPO has long maintained a close relationship with MediaTek,” said Henry Duan, Vice President at OPPO. “I am excited to share that the next Find X flagship will be the first to be launched with the Dimensity 9000 flagship platform. This is a premium device that brings together so many cutting-edge features in one device and we know users will be impressed with its breakthrough performance and outstanding energy efficiency.”
“vivo has always highly valued its partnership with MediaTek,” said Shi Yujian, Senior Vice President & CTO at vivo. “With the Dimensity series 5G chipsets and their state-of-the-art performance, energy efficiency, 5G connectivity, AI, imaging and video technologies, vivo has been able to deliver a broad lineup of high-end 5G products loved by its users. We are excited to see the Dimensity series finding more fans in the market. In 2022, we look forward to continuing to work closely with MediaTek to launch vivo’s first product powered by Dimensity 9000 flagship chip. We believe that the Dimensity series will continue to push the envelope on 5G applications and innovations.”
“Dimensity 9000 brings together the industry’s most cutting-edge features in one chipset,” said Lu Weibing, General Manager of Redmi. “It is currently one of the most advanced ‘ultra-flagship’ SoCs in terms of performance, video, gaming, communications or AI capabilities. Redmi is honored to be working with MediaTek for in-depth joint testing of Dimensity 9000 in the early stages, and achieved outstanding results in these tests. The Dimensity 9000 offers unprecedented performance, a true leap over prior generations, and I am very excited for the official commercialization of this chipset on our Redmi K50 series. With the overall improvements that the Dimensity 9000 platform brings to the table, and being an indispensable part of our Redmi K50 series, users can expect to see a noticeable, upgraded performance in our upcoming devices.”
“In 2021, Honor and MediaTek launched a comprehensive partnership across multiple product areas, including smartphones, tablets and smart screens. We introduced the HONOR View40 series, the V7 tablet series, and the X2 smart screen series, giving consumers high-quality experiences,” said Fang Fei, president of product line, HONOR Device Co., Ltd. “MediaTek’s new generation of flagship 5G mobile platforms offer impressive performance and energy efficiency. In the future, we look forward to deepening our cooperation with MediaTek to create even more innovative experiences for our fans.”
Smartphones powered by the MediaTek Dimensity 9000 flagship 5G mobile platform will be available in the market in the first quarter of 2022.
